ForTii®

High temperature mechanics:

The aromatic structure of ForTii combined with unique C4 chemistry results in a high melting point of 325°C and high stiffness across a wide temperature range, making its heat distortion temperature among the best in the industry. ForTii can replace metal at 50% of the weight without compromising performance.

Creep Performance:

Vs. Metal: ForTii Ace offers excellent creep performance, enabling weight reduction up to 50% and cost savings by eliminating compression limiters or threaded inserts, opening new metal replacement opportunities.

Vs. PPA & PA66: compared to PA66, ForTii significantly improves creep performance, outperforming low-Tg PPA materials (e.g., PA6T/66) and matching high-Tg competitor PPAs (e.g., PA6T/6I). ForTii Ace enhances creep performance at elevated temperatures up to 150°C and in moist conditions at lower temperatures.

Vs. Thermoset Materials: ForTii Ace allows engineers to convert thermoset designs to thermoplastic solutions, offering better yield rates and economic benefits, while maintaining good chemical resistance and stability under creep loading.

Chemical resistance:

Where ForTii MX1 - MX3 brings on par chemical resistance to best-in-class PPA materials, Envalior’s ForTii Ace portfolio adds an additional step-up in chemical performance. For highest chemical stability, Envalior has developed a broad portfolio in ForTii Ace, which includes injection moldable grades in 30%, 40% and 50% glass fiber. 

Reflow soldering for surface mount technology:

In the consumer market, there's a push for smaller, lighter products with more functionality. Miniaturized electromechanical components, like connectors and sensors, need reflow soldering technologies due to their small contact pitch, requiring materials that withstand high temperatures up to 280°C. ForTii, with a high melt temperature of 325°C and low moisture absorption, excels in SMT applications up to 288°C, ensuring minimal deformation and predictable warpage for designers.